The conference brings together engineers and scientists from all over the world to discuss recent progress and future trends in the fabrication and application of micro- and nanostructures and devices. Applications in electronics, photonics, electromechanics, energy, mobility, environment, life sciences, and biology are also discussed.
The topics are:
A. Micro- and Nanopatterning
- Photon lithography
- DUV, EUV, immersion, sources, optics, mask technology, alignment, optical proximity correction, modelling, throughput, double exposure
- Mask technology
- Electron and ion beam lithography
- sources, optics, systems, alignment, proximity corrections, modelling, ion and electron beam – surface interactions, direct writer
- Soft lithography: imprint, micro-contact
- stamp and its fabrication, systems, processes and imprinting methods, demoulding, throughput, modelling, alignment, overlay, damage, surface functionalization
- Materials for micro- and nanolithography
- resists for optical, e-beam, ion-beam and soft lithography, resist processing, resist structure, modelling
- Directed self assembly
- modelling, self-alignment, block copolymers
- Tip-based / scanning probe based patterning techniques
- mechanical modifications, thermal interactions, optical near-field, fluid-writing, nano-manipulation
- Stencil based patterning
- Novel techniques
- combination top-down bottom-up
B. Micro- and Nanofabrication
- Pattern transfer
- lift-off, new materials, sputtering, milling
- Plasma etching
- nanoscale etching, etching of new materials, deep etching, directional (lateral) etching
- E- and ion-beam induced deposition
- deposition, etching, modelling
- 3D nanomanufacturing
- integration of nano-objects, scale up and transfer to manufacturing
- 3D microprinting
- printing/deposition of nanoparticles, -tubes, -rods, rapid prototyping
- Inspection and process diagnostics and control
- (in-line) testing, (nano-) metrology, x-ray analyses, sample preparation for inspection, in-situ process measurements
- (Nano-) metrology
- dimensions, mechanical properties, electronic properties
- Self-aligned processes
- alignment, overlay, modelling
C. Micro/Nano Devices and Systems
- MEMS / NEMS
- RF-MEMS, MOEMS, surface micromachining, bulk micromachining, time-keeping devices, energy harvesting
- Micro and nano fluidic systems
- fluidic elements and their fabrication/integration
- Metamaterials and their fabrication
- Heterogeneous integration
- advanced materials, key enabling technologies, back-end-of-line
- System design
- Device and system modelling
- Micro/Nano devices for physical science
- nanoelectronics, single electron transistor devices, quantum computer, plasmonic devices
- Data storage
- magnetic devices, optical storage
- Assembling and packaging technologies
- materials, testing, reliability, modelling
- Reliability
- Applications
- in energy, automobile, traffic, sensors, RFID, building, …
D. Micro- and Nanotechnology/engineering for Life Sciences and Biology
- Sensing
- (bio-) chemical sensing, materials, transduction, in-vivo sensing
- Lab-on-a-Chip
- integration, fabrication, application, µ-TAS, proteomics, cell-omics
- Organ-on-a-Chip
- interfaces, culturing, sensing/observation, applications
- Micro/Nanofluidics for bio/life sciences
- fluidic elements, contamination, clogging, sorting
- System design and fabrication
- incl. modelling and simulation
- Applications
- point-of-care devices, Lab-on-a-Chip, diagnostics, theranostics
As in previous years, all presenters will be kindly asked to publish their contribution in the four special issues to appear after peer-reviewing in the Journal of Microelectronic Engineering.